Thermal pads
Thermal interface materials (TIMs) are designed to fill in air gaps and microscopic irregularities
Thermal grease and thermal pads are thermally conductive adhesive, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices). The grease and the pads give a mechanical strength to the bond between the heat sink and heat source, but more importantly, it eliminates air (which is a thermal insulator) from the interface area.
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