Electrically conductive adhesive (Shieldokit)

Electrically conductive adhesive (Shieldokit) 3980

Electrically conductive glue/adhesive. Shieldokit creates an electrically and thermally conductive connection between components.

Shieldokit creates an electrically and thermally conductive connection between components (electrically conductive adhesive). One of the applications is EMI shielding. The conductive glue cures at room temperature and has excellent filling properties. The viscosity of conductive glue is comparable to peanut butter, so it can be used to fill in uneven surfaces.

The product consists of a two-component epoxy-based glue containing 80% silver. It is a paste which can be applied to metals (copper, aluminium, stainless steel, brass, etc.), ceramics and most plastics.

Structure

Shieldokit is a solvent-free, silver pigmented adhesive, based on a two-component epoxy resin.

Special characteristics

The kit creates a strong connection with excellent conductivity. It is designed to connect temperature-sensitive components.

Application

Shieldokit is designed to connect parts at temperatures between 20 °C and 80 °C. The adhesive can be applied with a dispenser or by screen printing. Tools have to be cleaned immediately after use.

Used for:

Gluing components that cannot be soldered
Connections that require excellent electrical conductivity
Connections that have to be thermally conductive
Repairing non-solderable components
Gluing objects to a plastic enclosure where an electrically conductive linkage is needed
Restoration of flat cables, SMD components, etc.

Packaging

Shieldokit is supplied in small containers of 30 grams of glue (component A) and a syringe filled with hardener (component B). Optional bigger packages are available on request. For more details see our technical datasheet.

Storage

Component A
At temperatures below 25 °C the product can be stored up to 2 years in its original sealed packaging.

Component B
Hardener can be stored between 5 °C and 40 °C.

Specifications / Technical data

Silver content	% by weight	80%
Viscosity (D = 25s-1)	mPas	20.000 - 30.000
Mixing ratio Shieldokit conductive glue (component A) and hardener (component B)		50 : 1
Drying recommendations (depends on parameters like layer thickness, application and drying process)	h/°C min./°C	24/rt 180/80
Surface resistance of the layer at 80 °C (depends on parameters like layer thickness, application and drying process)	mΩ/cm²	< 100
Temperature stability of separate components	°C	- 40 to + 150
Hardener		Shieldokit hardener (component B)