Electrically conductive metallization 3838

For higher EMI/RFI-shielding demands and larger quantities we can sputter a fully metal, electrically conductive coating onto 90% of all commonly used plastics, including even PTFE. The metallization is applied in the form of a sandwich of three thin layers of metal.

Electrically conductive metallization 3838

Sputtering is a technique used to create a thin layer of metal on a part made out of synthetic material. This technique is used for protective coatings that meet extremely high standards.

The process takes place in a high-vacuum chamber, in which argon is brought to a pressure of about 5E-3 mbar. On one wall is sputtered material, this is the so-called target. On the opposite side is the substrate. This is the material the sputtered material to be made. A voltage of around-500V is applied on the target. With these pressures in an argonplasma of such positive ions, these ions move visibility into the negatively charged target, the collision with the target material are released and move to the other side fails. After a certain time has a thin layer. Sputtering is faster when the target is behind a magnet. The magnetic field creates an electronic track with a round (or oval) forms in the target erosion pattern. Not even metals can be sputtered instead of a DC voltage is an RF voltage is used (usually 13.65 MHz). Sometimes it can / should be a gas (along with argon) to create the desired layer. This is called reactive sputtering.

By this metal ion bombardment melting the metal particle as it were, into the plastic without being affected. And a high degree of adhesion is the result.

First a thin layer of stainless steel, to prevent the softeners in the plastic affecting the shielding. Secondly a thin layer of copper for superb shielding performance. And thirdly another layer of stainless steel to avoid corrosion.

It is also possible to only metallize a part of your plastic housing. That we call selective metallization.


Conductive metallization applications

  • Shielding/Screening (EMI, RFI)
  • To meet EMC standards
3838 series Conductive metallisation
3838 series Conductive metallization

3838 - Conductive metallization shielding performance table

Frequency (Mhz) Attenuation (dB)
30 50
100 58
200 70
500 74
700 72
900 70
These values are measured under laboratory conditions.
In your situation results may differ, please read our Guarantee.

3838 - Conductive metallization shielding performance graph

Please note : These values are measured under laboratory conditions. Results may vary in other situations; please read our Guarantee.


Notice:

For this product there are no free samples available


 

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