Thermal interface materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling
Thermal interface material is used to fill the gaps between thermal transfer surfaces such as between microprocessors and heat sinks, in order to increase the efficiency of thermal transfer. There is usually air in these gaps, and air is a notoriously poor conductor. The interface material is easy to handle and is not messy. It is available in solid and liquid form and comes in various thicknesses.
The thermal conductivity of the interface material determines its thermal performance to a large extent. The high thermal conductivity of this product guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation.
This film, wih its excellent thermal and electrical properties, is especially suitable for high-power applications. The material performs so well that it can be used reliably in densely packed electronic applications.
|These values are measured under laboratory conditions.
In other situations results may differ; please read our Guarantee.
|Part number||Thermal conductivity||Thermal resistance||Hardness||Characteristics|
|6.0||0.20||60-70||Highest thermal conductivity|
|1150-500||5.0||0.25||75||High thermal conductivity|
|1150-300||3.0||0.41||65||Flexible; high thermal conductivity|
|1150-320||2.5||0.50||30-35||Very soft, good dielectric properties|
|1150-255||2.0||0.85||30||Soft, high thermal conductivity|
|1150-202b||1.4||0.90||25||Good price/performance ratio|
|1150-105||1.3||0.95||60||Low bleeding behaviour|
|1150-200||1.0||1.5||10||Soft, highly compressible|
|1150-210lb||1.0||1.5||15||Low bleeding behaviour|
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