Thermal interface material (TIM) 1150 series

Thermal interface materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling

Thermal interface material is used to fill the gaps between thermal transfer surfaces such as between microprocessors and heat sinks, in order to increase the efficiency of thermal transfer. There is usually air in these gaps, and air is a notoriously poor conductor. The interface material is easy to handle and is not messy. It is available in solid and liquid form and comes in various thicknesses.

Thermal conductivity

The thermal conductivity of the interface material determines its thermal performance to a large extent. The high thermal conductivity of this product guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation.


  • Good insulation properties
  • Heat conducting
  • Good compressibility
  • Flexible
  • Environmentally friendly


  • Smooth surface
  • Very good thermal transfer properties even at minimal contact pressure
  • Low hardness
  • High self-adhesion
  • UL listed
  • Thicknesses of 0.01 to 8 mm

This film, wih its excellent thermal and electrical properties, is especially suitable for high-power applications. The material performs so well that it can be used reliably in densely packed electronic applications.

Thermal pads | Thermal interface material
Thermal interface material, thermal pads
Thermal pads | Thermal interface material
Thermal interface material under heatsink

Standard part numbers

These values are measured under laboratory conditions.
In other situations results may differ; please read our Guarantee.
Part number Thermal conductivity Thermal resistance Hardness Characteristics
  W/mK K/W Shore 00  


6.0 0.20 60-70 Highest thermal conductivity
1150-500 5.0 0.25 75 High thermal conductivity
1150-300 3.0 0.41 65 Flexible; high thermal conductivity
1150-320 2.5 0.50 30-35 Very soft, good dielectric properties
1150-255 2.0 0.85 30 Soft, high thermal conductivity
1150-202b 1.4 0.90 25 Good price/performance ratio
1150-105 1.3 0.95 60 Low bleeding behaviour
1150-200 1.0 1.5 10 Soft, highly compressible
1150-210lb 1.0 1.5 15 Low bleeding behaviour
Thermal interface material | fill the gaps between thermal transfer surfaces Thermal interface material | fill the gaps between thermal transfer surfaces Holland Shielding Systems B.V. Holland Shielding Systems B.V.
Rated 5/5 based on 9 customer reviews
In stock
Product description: Used to fill gaps between thermal transfer surfaces. Guarantees sufficient heat transfer resulting in better cooling. Available in solid & liquid form.

To get a quotation for Thermal pads within 24 hours fill in the form below.

Part number
Select an option:
1150-600 : W/mK 6.0
1150-500 : W/mK 5.0
1150-300 : W/mK 3.0
1150-320 : W/mK 2.5
1150-255 : W/mK 2.0
1150-202b : W/mK 1.4
1150-105 : W/mK 1.3
1150-200 : W/mK 1.0
1150-210lb : W/mK 1.0
Thickness (mm)
Specify the thickness in mm. Thicknesses available from 0.01 to 8 mm
Width (mm)
Specify the width in mm
Length (mm)
Specify the width in mm
* Note: The red blocks are required


EMC-IP gasket


Flat cable connector shield


Ultra soft shield


Frameless Honeycomb vents


UHF Ferrite absorber tiles


Drawn board level shields